エポキシ樹脂用潜在性硬化剤

エポキシ樹脂用潜在性硬化剤

Product Summary

ノバキュア
Asahi KASEI Latent Hardener is the world’s only liquid latent hardener and curing accelerator for epoxy resins, developed based on microcapsulation technology.
Asahi KASEI Latent Hardener provides excellent storage stability and curing properties by dispersing the microencapsulated hardener component in a liquid epoxy resin to form a master batch.Asahi KASEI Latent Hardener enables single-component epoxy resin formulations, as a curing agent/catalyst for acid anhydrides, dicyandiamide and thiols.

Feature

Point.01
Ready to use formula, pre-mixed in liquid epoxy resin

Point.02
Excellent storage stability and high reactivity

Point.03
High heat resistance of cured products

Point.04
Wide range of products from low temperature fast curing products to high temperature stable products

Point.05
Solvent compatible grades available

Use

Electronics, Electrical appliances, Automobiles, Composites, Civil engineering, etc.
Electronics
phone

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Automobiles, and other industries
automobiles

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Applicapable shape
Applicapable shape

Liquid adhesive

Liquid adhesive

Sheet adhesive

Sheet adhesive

Curing Mechanism

How does Asahi Kasei Latent Hardener work?

Hardening mechanism

graph

Comparison table

Comparison of storage stability under 40ºC (Pa・s)
initial Day 3 Day 7 Day 15
HX-3722 ※1 30phr 18.4 18.5 18.5 18.5
HX-3742 ※1 30phr 18.4 18.2 18.2 18.3
HX-3088 ※1 30phr 18.1 18.0 18.1 18.1
Non capsulized hardener ※2 20phr 24.5 31.0 35.4 56.3
graph
graph

Line-up

We have a wide range of products by different reactivities and suitable curing temperatures, depending on the thickness of the microcapsule membrane and the average particle size of the hardener component. The products with a thin membrane have excellent low-temperature reactivity, and those with a thick membrane have excellent stability (which provides filler resistance and solvent resistance). The HP grades are suitable for electrical/electronic component applications due to the controlled chlorine content.
Please contact us if you have any requests such as viscosity and curing start temperature.
Grade Mean
particle
size
[um]
Capsule
thickness
Feature Viscosity
[Pa・s]
Gel time
(Resin composition)
[min]
90℃ 130℃ 170℃
HX-3722 2 Thin Low temp,(80℃〜) and rapid cure 100~500 11 1 <1
HX-3742 2 Thick Long pot life(with acid anhydride) 200~600 >30 >30 <1
HX-3088 2 Ex-thick Long pot life(with acid anhydride) 200~700 >30 >30 >30
HX-3921HP 5 Thin Low temp,rapid cure
Low chlorine type
50~130 11 1 <1
HX-3941HP 5 Thick Long pot life / solvent stable
Low chlorine type
50~250 >30 <1 <1
HXA3922HP 2 Thin Low temp,rapid cure
Low chlorine type
70~200 14 1 <1
HXA3932HP 2 Thick Long pot life / solvent stable
Low chlorine type
50~200 >30 1 <1

Products mentioned above are common grades.
please contact us if you have any requests regarding viscosity, curing start temperature, etc.
※Liquid BisA type epoxy resin(EEW:180g/eq):Latent Hardener=100:30 (Recommended formulation ratio)

Academic

月刊JETI2013  8月号・エポキシ樹脂と硬化剤の技術
Kenzo Onizuka
Research & Development Group Performance Curing Material Business Unit  Electronics Materials Division

PDFをダウンロード
接着学会誌_Vol53_No4(2017)・エポキシ樹脂硬化剤について
Kenzo Onizuka
Research & Development Group Performance Curing Material Business Unit  Electronics Materials Division

PDFをダウンロード

Contact

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Hibiya Mitsui Tower 1-1-2 Yurakucho, Chiyoda-ku, Tokyo 100-0006 Japan
ASAHI KASEI CORPORATION Electronics Materials Division
Performance Curing Material Sales & Marketing Group
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